IC PACKAGING TECHNOLOGY EXPO - Japan's MOST POWERFUL Exhibition specialised in IC Final Manufacturing and Packaging Technology for Sensors, MEMS Devices, Opto Devices, etc.

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Gathering wide variety of Packaging Technologies for IC Devices!

All kinds of products, technologies and services; equipment, device and material, that can contribute to miniaturization and thinning of cutting edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather. ICP is an essential business venue for the specialists from a variety of fields to seek the packaging technology.

NEPCON JAPAN 2010 Show's Movie

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ICP Show Management
Reed Exhibitions Japan Ltd.
Attn.: Kanako Otsuka (Ms.), Hajime Suzuki (Mr.),

Taikoku Kin (Mr.)

18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku,
Shinjuku-ku, Tokyo 163-0570, Japan
TEL: +81-3-3349-8502 FAX: +81-3-3349-4900
E-mail: inw@reedexpo.co.jp

	▸ To Exhibit Exhibition Outline Merits of Exhibiting Photo Highlight 2010 Previous List of Exhibitors Support for Exhibitors Schedule for Exhibitors Exhibiting Info Request		▸ Previous Show Visitor Count Photo Highlight 2010 Show's Movie List of Exhibitors e-Guidebook Technical Conference Floor Plan		▸ To Visit Visitor Pre-registration Access to Venue Hotel Accommodation Tokyo Sightseeing		▸ For Press News Release Visitor Count Photo Highlight 2010 Show's Movie 2010 Previous Highlights of Exhibitors Media Partners		▸ Registrations Exhibiting Info Request Visitor Pre-registration		▸ Concurrent Shows NEPCON JAPAN ├INTERNEPCON JAPAN ├ELECTROTEST JAPAN ├ELE TRADE ├PWB EXPO ├MATERIAL JAPAN └MicroTech JAPAN CAR-ELE JAPAN EV JAPAN Automotive Lightening Technology Expo LIGHTING JAPAN