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Dates: Jan. 18 [Wed] - 20 [Fri], 2017
Venue: Tokyo Big Sight, Japan Organised by: Reed Exhibitions Japan Ltd.
Advanced products/technologies/services will be showcased, necessary for downsizing and advance of semiconductors, LEDs, power devices, sensors and MEMS devices. Must-attend show for all technical persons involved in IC packaging.
ICP Show ManagementReed Exhibitions Japan Ltd.18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, JapanTEL : +81-3-3349-8519FAX : +81-3-3349-8530E-mail : For Exhibiting>> firstname.lastname@example.orgFor Visiting>>email@example.com
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