About ICP

Gathers wide variety of Packaging Technologies for IC Devices!

All kinds of products, technologies and services that can contribute to miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather here. ICP is an essential business venue for the professionals from a variety of fields to seek for packaging technologies.

Concurrent Shows

Contact Us

ICP Show Management
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL : +81-3-3349-8518
FAX : +81-3-3349-8530
E-mail : inw@reedexpo.co.jp

Organised by Reed Exhibitions