Exhibition Outline

  • Visitor Profile

    Professionals of semiconductor assembly & electronics manufacturers in fields such as:
    Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc.
    Visitors are from:

    • Semiconductor Manufacturers
    • Assembly Manufacturers/SATS
    • Sensor Manufacturers
    • Set Manufacturers (in high-density SMT)
    • MEMS Devices/LED Manufacturers
    • Automotive Electronics Manufacturers
    • Exhibit Profile

      Assembly Equipment

      • Wire Bonders
      • Die Bonders
      • FC Bonders
      • Other Various Bonders
      • Molding Machines
      • Resin Coating Machines
      • Dicing Machines
      • Lead Processing Machines
      • Laser Processors
      • Other Equipment for IC Packaging

       

      Packaging Materials/Components

      • Sealant (Mold Materials)/Under-fill Materials
      • ACF/NCF, ACP/NCP
      • Die Adhesives
      • Lead Frames
      • Bonding Wires
      • Tape Materials
      • Soldering Balls/Materials
      • Bump Materials
      • Packaging Substrates
      • (PCBs, Tape Substrates, Ceramic Substrates, etc.)
      • Other Materials/Components

       

      Analysis/Simulation Software for IC Packaging

      • Analysis Services/Software
      • Simulation Software
      • Various Software, etc.

       

      Various Packages

      • CSP
      • BGA
      • Wafer Level CSP
      • MCM, etc.
    • Semiconductor Device Inspection & Testing Zone

      Specialised in Inspection Equipment/Testers/Measurement for Semiconductor Device!

      • Memory Testers
      • SoC Testers
      • IC Test Sockets
      • IC Test Clips
      • Inspection Connectors
      • Burn-in Inspection Equipment
      • (Reliability Test, Thermal Resistance Test)
      • IC Vision Inspection System
      • Bump Vision Inspection System
      • X-ray Inspection Equipment
      • Circuit Modification System/Software
      • Defect Analysis System/Software
      • Measurement Equipment
      • Test Services
      • Analysis Services
      • Handlers
      • Probe Cards
      • Probes  etc.
    • SATS/Contract Design Services Zone

      Gathering World's TOP companies specialised in IC design, assembly and testing services!

      • Semiconductor
      • LED Packaging Solutions
      • Sensor Module Assembly
      • Mounting, Packaging Solutions
      • MEMS Device Packaging Solutions
      • Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.
    • SATS/Contract Design Services Zone

      Gathering World's TOP companies specialised in IC design, assembly and testing services!

      • Semiconductor
      • LED Packaging Solutions
      • Sensor Module Assembly
      • Mounting, Packaging Solutions
      • MEMS Device Packaging Solutions
      • Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.
    • Plating/Etching Zone

      Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.

      • Plating Materials/Chemicals/Equipment
      • Plating Process
      • Etching Chemicals/Equipment
      • Etching Process
      • Inspection Equipment
      • Surface Processing Technology/Related Products, etc.
    • MEMS Packging Zone

      3D Integration, 3D Packaging Technologies for MEMS Devices Gather!

      [MEMS Device Manufacturing Equipment]

      • Dicing Machines
      • Die Bonders
      • Wire Bonders
      • Flipchip Bonders
      • Microchip Bonders etc.

      [Molding Machines]

      • Welding Machines
      • Fine Processing Equipment
      • Drilling Machines
      • Plating Equipment
      • Coating Machines
      • Sputtering System
      • Exposure Equipment
      • Vacuum Equipment
      • Bonding Equipment
      • Heat Press Machines
      • Imprinting Systems
      • Coaters, Developers
      • Spray Coaters
      • Embossing Systems
      • Laser Beam Writers
      • Etching Equipment
      • Cleaning Systems
      • Drying Systems
      • Conveying Equipment etc.

      [Evaluation/Measurement/Testing Equipment]

      • Measurement Equipment
      • Evaluation Equipment
      • Analysis Equipment
      • Microscopes (Laser Microscopes, Electron Microscopes, Transmission Electron Microscopes, etc.)
      • Analysis Systems
      • Vision Inspection Equipment
      • X-ray Inspection Equipment etc.

      [MEMS Packaging Materials]

      • Substrates
      • Lead Frames
      • Glass Substrates
      • Silicon Wafers
      • SB Wafers
      • Soldering Balls
      • Bump Materials
      • Adhesives
      • Taping Materials
      • Sealants
      • Bonding Wires
      • Plating Materials, Chemicals
      • Chemicals
      • Etching Materials
      • Nano-imprint Materials
      • Resist Materials
      • Adhesives
      • Protective Materials etc.

      [MEMS Foundry Services (Contract Design, Prototype, Manufacturing)]

      [Design Tools, Analysis and Simulation Software]

      [Other Various MEMS Packaging Technologies]

VIP Registration

Contact Us

ICP Show Management
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL : +81-3-3349-8519
FAX : +81-3-3349-8530
E-mail :
For Exhibiting>>
inw@reedexpo.co.jp
For Visiting>>
visitor-eng.inw@reedexpo.co.jp

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