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Dates: Jan. 18 [Wed] - 20 [Fri], 2017
Venue: Tokyo Big Sight, Japan Organised by: Reed Exhibitions Japan Ltd.
Dates: January 18 [Wed] - 20 [Fri], 2017
Venue: Tokyo Big Sight, Tokyo, JAPAN
Organised by: Reed Exhibitions Japan Ltd.
18th IC PACKAGING TECHNOLOGY EXPO
Special Exhibit Zones:
Concurrent Shows held inside NEPCON JAPAN 2017 – 46th Electronics R&D and Manufacturing Technology Expo
Concurrent Shows of NEPCON JAPAN 2017 – 46th Electronics R&D and Manufacturing Technology Expo
Professionals of semiconductor assembly & electronics manufacturers in fields such as:Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc. Visitors are from:
Analysis/Simulation Software for IC Packaging
Gathering World's TOP companies specialised in IC design, assembly and testing services!
Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.
ICP Show ManagementReed Exhibitions Japan Ltd.18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, JapanTEL : +81-3-3349-8519FAX : +81-3-3349-8530E-mail : For Exhibiting>> email@example.comFor Visiting>>firstname.lastname@example.org
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