• Exhibit Profile

    Assembly Equipment

    • Wire Bonders
    • Die Bonders
    • FC Bonders
    • Other Various Bonders
    • Molding Machines
    • Resin Coating Machines
    • Dicing Machines
    • Lead Processing Machines
    • Laser Processors
    • Other Equipment for IC Packaging

     

    Packaging Materials/Components

    • Sealant (Mold Materials)/Under-fill Materials
    • ACF/NCF, ACP/NCP
    • Die Adhesives
    • Lead Frames
    • Bonding Wires
    • Tape Materials
    • Soldering Balls/Materials
    • Bump Materials
    • Packaging Substrates
    • (PCBs, Tape Substrates, Ceramic Substrates, etc.)
    • Other Materials/Components

     

    Analysis/Simulation Software for IC Packaging

    • Analysis Services/Software
    • Simulation Software
    • Various Software, etc.

     

    Various Packages

    • CSP
    • BGA
    • Wafer Level CSP
    • MCM, etc.
  • SATS/Contract Design Services Zone

    Gathering World's TOP companies specialised in IC design, assembly and testing services!

    • Semiconductor
    • LED Packaging Solutions
    • Sensor Module Assembly
    • Mounting, Packaging Solutions
    • MEMS Device Packaging Solutions
    • Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.
  • Plating/Etching Zone

    Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.

    • Plating Materials/Chemicals/Equipment
    • Plating Process
    • Etching Chemicals/Equipment
    • Etching Process
    • Inspection Equipment
    • Surface Processing Technology/Related Products, etc.

Contact Us

ICP Show Management
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL : +81-3-3349-8519
FAX : +81-3-3349-8530
E-mail :
For Exhibiting>>
inw@reedexpo.co.jp
For Visiting>>
visitor-eng.inw@reedexpo.co.jp

Organised by Reed Exhibitions