Exhibit Profile - 15th IC PACKAGING TECHNOLOGY EXPO - Japan's MOST POWERFUL Exhibition specialised in IC Final Manufacturing and Packaging Technology for Sensors, MEMS Devices, Opto Devices, etc.

Exhibit Profile

Assembly Equipment
Wire Bonders Die Bonders FC Bonders Other Various Bonders Molding Machines	Resin Coating Machines Dicing Machines Lead Processing Machines Laser Processors Other Equipment for IC Packaging

Packaging Materials/Components
Sealant (Mold Materials)/Under-fill Materials ACF/NCF, ACP/NCP Die Adhesives Lead Frames Bonding Wires Tape Materials	Soldering Balls/Materials Bump Materials Packaging Substrates (PCBs, Tape Substrates, Ceramic Substrates, etc.) Other Materials/Components

Analysis/Simulation Software for IC Packaging
Analysis Services/Software Simulation Software	Various Software, etc.

Various Packages
CSP BGA	Wafer Level CSP MCM, etc.

Semiconductor Device Inspection & Testing Zone

Specialised in Inspection Equipment/Testers/Measurement for Semiconductor Device!

SATS/Contract Design Services Zone

Gathering World's TOP companies specialised in IC design, assembly and testing services!

Mounting, Packaging Solutions
MEMS Device Packaging Solutions
Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.

Plating/Etching Zone

Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.

MEMS Packging Zone

3D Integration, 3D Packaging Technologies for MEMS Devices Gather!

[MEMS Device Manufacturing Equipment］
Dicing Machines Die Bonders Wire Bonders	Flipchip Bonders Microchip Bonders etc.
[Molding Machines］
Welding Machines Fine Processing Equipment Drilling Machines Plating Equipment Coating Machines Sputtering System Exposure Equipment Vacuum Equipment Bonding Equipment Heat Press Machines	Imprinting Systems Coaters, Developers Spray Coaters Embossing Systems Laser Beam Writers Etching Equipment Cleaning Systems Drying Systems Conveying Equipment etc.
[Evaluation/Measurement/Testing Equipment］
Measurement Equipment Evaluation Equipment Analysis Equipment Microscopes (Laser Microscopes, Electron Microscopes, Transmission Electron Microscopes, etc.)	Analysis Systems Vision Inspection Equipment X-ray Inspection Equipment etc.
[MEMS Packaging Materials］
Substrates Lead Frames Glass Substrates Silicon Wafers SB Wafers Soldering Balls Bump Materials Adhesives Taping Materials	Sealants Bonding Wires Plating Materials, Chemicals Chemicals Etching Materials Nano-imprint Materials Resist Materials Adhesives Protective Materials etc.
[MEMS Foundry Services (Contract Design, Prototype, Manufacturing)］
[Design Tools, Analysis and Simulation Software］
[Other Various MEMS Packaging Technologies］

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