Previous (2012) Technical Conference Program

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• ICP-K Block

  

  ICP-K Keynote Session

  Jan. 19 [Thur] 10:00-11:30 Future Outlook of Semiconductor Business -Keys to Enhance Electronics Industry-

  Session Leader： Toshihiko Sato, Renesas Kyushu Semiconductor Corp. Assistant Leader： Jun-ichi Kasai, SKLink Co., Ltd.
  Evolution of Semiconductor: For Future Society and New User Experience	Amkor Strategy for Packaging Technology
  Tsuyoshi Abe Director and Vice President, and General Manager of Technology & Manufacturing Group, Intel K.K.	Choon-Heung Lee Corporate Vice President, Head of Corp. Technology HQ, Amkor Technology Korea, Inc.

  
  

• ICP-S1

  

  ICP-S1 Special Session 1

  Jan. 19 [Thur] 16:15-17:00 Lecture by Leading Authority in Automotive Semiconductor Packaging Field

  Automotive Electronics ―Packaging as Enabler Technology

  Andreas Knoblauch Director Package Development Automotive, Infineon Technologies AG

• ICP-S2

  

  ICP-S2 Special Session 2

  Jan. 20 [Fri] 9:30-10:15 Current Industry Trend in China

  Development of Chinese Electronic Industry and Semiconductor Package

  Noriyoshi Kuromasa Shanghai Bureau Chief, Sangyo Times, Inc.

• ICP-S3

  

  ICP-S3 Special Session 3

  Jan. 20 [Fri] 12:30-13:15 Lecture by Taiwan's No.1 LED Manufacturer

  LED Packaging Technology Impact on Lighting Applications

  Ilkan Cokgor Vice President, Global Marketing, Everlight Electronics Co., Ltd.

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  ＜Other Sessions＞

  All Sessions Available in English / Japanese

• ICP-1 IC Packaging Roadmaps for Smaller and Thinner Package with Higher Function Jan. 18 [Wed] 9:30-12:00

  ICP-6 Latest Material Technology for Advanced IC Packaging Jan. 18 [Wed] 9:30-12:00

  Dept. Manager, Advanced Package Development Dept., Packaging & Test Technology Div., Production and Technology Unit, Renesas Electronics Corp. Keiichirou Kata Chief Specialist, Memory Packaging Engineering Dept., Memory Div., Toshiba Corp., Semiconductor & Storage Products Co. Ryoji Matsushima Manager, Product Development Dept. I, LSI Packaging Div., IP & Technology Development and Manufacturing Unit, FUJITSU Semiconductor Ltd. Hirohisa Matsuki

  Manager, Research Dept., Electronic Device Materials Research Lab., Sumitomo Bakelite Co., Ltd. Hiroshi Fujita Group Manager, Insulating Material Development U., Technical R&D Div., NAMICS Corp. Haruyuki Yoshii Fundamental Technology Development Center, Polymer Technology Group, Hitachi Chemical Co., Ltd., Tsukuba R&D Center Toshiaki Shirasaka

• ICP-2 Latest Trends of Semiconductor Manufacturers Worldwide Jan. 18 [Wed] 13:30-16:00	ICP-7 Recent Status of LED Mounting Technology and Sealing Materials Jan. 18 [Wed] 13:30-16:00
  Senior Engineer, Test&Package Center, Samsung Electronics Co., Ltd. Sungil Cho Vice President, Marketing and Business Development, Amkor Technology, Inc. Lee J. Smith Director, STATS ChipPAC Ltd Japan Toshihiko Nishio	Visiting Lecturer, Faculty of Engineering, Osaka University/Director, Nagano Jisso Forum Haruo Tabata Assitant Manager, New Products Section I, Products Development Dept., Advanced Material Div., Sony Chemical & Information Device Corp. Hidetsugu Namiki Chief Researcher, Silicone-Electronics Materials Research Center, Shin-Etsu Chemical Co., Ltd. Eiichi Tabei

• ICP-3 Smartphones, Tablets & Ultra-books ―Most-advanced Packaging Technology― Jan. 19 [Thur] 13:30-16:00	ICP-8 Cutting Edge of MEMS Technology ―Practical Applications and Technical Challenges― Jan. 19 [Thur] 13:30-16:00
  Group Manager, Memory Application Engineering Group 2, Memory Application Engineering Dept., Memory Div., Toshiba Corp. Semiconductor & Storage Products Co., Masashi Yokotsuka General Manager, Packaging Research&Development Center, J-Devices Corp. Akio Katsumata Executive Vice President, Corporate R&D, STATS ChipPAC Korea Ltd. Kenny Lee	Project Manager, Advanced Packaging, Yole Développement Jérôme Baron General Manager, Product & Technology Development, Micro Devices H.Q., OMRON Corp. Yoshitake Ito Professor, Institute of Engineering Innovation (IEI), The University of Tokyo Takayuki Ohba

• ICP-4 Evolving 3D Packaging Innovates Devices and the World Jan. 20 [Fri] 9:30-12:00	ICP-9 Future of Automotive Electronics & IC Packaging Technology Jan. 20 [Fri] 9:30-12:00
  Senior Technical Staff Member, Electronic & Optical Packaging Tokyo Research Lab., IBM Japan, Ltd. Yasumitsu Orii Chief Specialist, Memory Packaging Development Dept., Memory Div., Toshiba Corp. Semiconductor & Storage Products Co. Hirokazu Ezawa Manager, Copper Pillar and TSV Interconnect Packaging, Texas Instruments Inc. Mark Gerber	Executive Officer, President of Automotive Electronics Div., BOSCH Corp., Japan Konrad F. Kaschek Director, IC Eng. Div. 3, DENSO Corp. Hiroshi Fujimoto Chief Professional, Lead Frame Package Engineering Dept., Packaging & Test Technology Div., Production and Technology Unit, Renesas Electronics Corp. Tatsuhiko Akiyama

• ICP-5 Keys to Cost Reduction ―Recent Copper Wirebonding Technology― Jan. 20 [Fri]13:30-16:00

  ICP-10 Most-current Development Trends in Power Devices for Power Saving Jan. 20 [Fri]13:30-16:00

  Director of Technical Marketing, ASE Group Andy Tseng Product Manager, Bonding Wire, Heraeus Materials Technology Roman Perez Senior Scientist, Process R&D, Ball Bonder Div., Kulicke and Soffa Industries, Inc. Horst Clauberg

  General Manager, Electronics Development Div. 3, Toyota Motor Corp. Kimimori Hamada Operating Officer and Electronic Device CTO, General Manager, Electronic Device Lab., Corporate R&D Headquarters, Fuji Electric Co., Ltd. Tatsuhiko Fujihira Dept. Manager, Automotive Power Device Design Dept., Power Devices Business Div., Analog & Power Devices Business Unit, Renesas Electronics Corp. Katsuo Ishizaka

• All Sessions

  All Sessions Available in English / Japanese
  (*Keynote Sessions: English, Chinese, Korean & Japanese.)

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  ＜Concurrent Shows: Keynote Sessions＞

• PWB-K Block (For other Exhibit)

  

  PWB-K Keynote Session

  Jan. 19 [Thur] 13:30-15:00 Top Manufacturers Reveal their Strategies and Future Visions

  Session Leader： Hirofumi Matsumoto, Nippon Mektron, Ltd. Assistant Leader： Koji Ikawa, CMK Corp.
  BMW i–products and Services for Urban Mobility	Evolution of Mobile Data Devices
  Bernhard Blaettel Director, Project Mobility Services, BMW AG	Shigeyoshi Shimotsuji General Manager, Cloud & Solutions Div., Toshiba Corp.

• INJ-K Block(For Other Exhibit)

  

  INJ-K Keynote Session

  Jan. 18 [Wed] 13:30-15:00 Industry Leaders' View: Strength of "Japan's Manufacturing Technologies"

  Perspective Direction for Electronic System View from Super High Band Communication	Fujitsu's Technology that Developed the "K Computer"
  Kanji Otsuka Emeritus Professor, Advisor, Collaborative Research Center of Meisei University	Hideyuki Saso Corporate Senior Executive Vice President, Fujitsu Ltd.

• CAR-K Block (For other Exhibit)

  

  CAR-K Keynote Session

  Jan. 18 [Wed] 10:30-12:30 Leading Manufacturers Discuss Future Automotive Electronics for Next-generation Vehicles

  Rapidly Changing Automotive Industry and its Expectations for Car Electronics	Volkswagen Group Strategy for Electric Mobility	Ford's Sustainable Electrification Approach
  Moritaka Yoshida Managing Officer, Toyota Motor Corp.	Rudolf Krebs Executive Vice President, Head of Group E-Traction, Volkswagen AG	Nancy Gioia Director, Global Electrification, Ford Motor Company

• Light-K Block (For other Exhibit)

  

  Light-K Keynote Session

  Jan. 18 [Wed] 13:30-15:30 Corporate Strategies of Global Lighting Manufacturers

  Session Leader： Yoshiteru Sato, New Energy and Industrial Technology Development Organization
  Simply Enhancing Life with Light	Creating Tomorrow: Mastering the Transition to SSL Lighting	Paradigm Shift of General Lighting by LED and New Product Strategy of Toshiba
  Marc de Jong CEO, Business Group Professional Lighting Solutions, Executive Vice President, Philips Lighting	Carsten Setzer Senior Vice President, General Lighting Development, OSRAM AG	Koji Sato Vice President & General Manager, LED Business Group, Toshiba Lighting & Technology Corp.

• (Honorifics omitted)

  * Please note that the speakers and programs are subject to change.
  * The photographic and video recording rights are reserved to the Show Management.
  *Textbooks of some sessions are not available.
  

  For more information, please contact: inw-con@reedexpo.co.jp

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  Asia's Largest Scale! Learn the cutting-edge in 185 sessions.

  Choose and Click the ones of your interest for details.

  

  Latest technologies and industry trends will be addressed; from Lead-free Soldering, Micro Joint, Cutting-edge Testing Technologies, to Applications to the hottest fields such as Smartphones, Power Modules, etc.

  

  3 Dimensional Assembly, TSV, Copper Wire, In-vehicle Semiconductors, Power Devices, etc., the latest technology trends of IC Packaging.

  

  Device Embedded Substrates, Printed Electronics, Heat-resistant Technologies, FPC etc., the latest technologies and industry trends of PCBs.
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  EV/HEV, Motors, Secondary Batteries, Safety Technologies, the Key to Grab the Emerging Markets, etc., hottest topics in the industry.

  

  Industry trends, Strategies of leading companies, Element technologies, etc., various approaches to LED & OLED Lighting.