【ICP-1】IC Packaging Roadmaps for Smaller and Thinner Package with Higher Function

Renesas Electronics's Semiconductor Package Roadmap

［Speaker］
Keiichirou Kata
Dept. Manager, Advanced Package Development Dept., Packaging & Test Technology Div., Production and Technology Unit,
Renesas Electronics Corp.

[Abstract]
The role of the semiconductor packaging is getting more important to achieve the various customer requirements for size and cost reduction, as well as higher functions and faster speed. In response to market demands, the latest technology trends in Renesas Electronics semiconductor packaging technology will be introduced.

Toshiba Memory Package Technology Trends ―Equipment, Material and Process Issues for Thin Package―

［Speaker］
Ryoji Matsushima
Chief Specialist, Memory Packaging Engineering Dept., Memory Div.,
Toshiba Corp., Semiconductor & Storage Products Co.

[Abstract]
Evolution of packaging technology requires for thin and high speed mobile devices. The equipment, material and process issues for thin package will be introduced.

Packaging Technology Roadmap in Fujitsu Semiconductor

［Speaker］
Hirohisa Matsuki
Manager, Product Development Dept. I, LSI Packaging Div., IP & Technology Development and Manufacturing Unit,
FUJITSU Semiconductor Ltd.

[Abstract]
Fujitsu Semiconductor provides wide range LSI products for high end equipments or consumer equipments. We will outline the technology and roadmap for our each package.

(Honorifics omitted)

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