Evolution of Semiconductor: For Future Society and New User Experience
［Speaker］
Tsuyoshi Abe
Director and Vice President, and General Manager of Technology & Manufacturing Group
Intel K.K.
[Abstract]
The number of devices connected to the Internet is expected to exceed 15 billion in 2015. This paper will describe the efforts at Intel to develop semiconductor products with an expanding range of applications.
[Profile]
1985
1985
1999
2002
July 2005
May 2007
April 2009
May 2011 |
Graduated from Kinki University, Dept. of Engineering, Electrical Engineering course.
Joined Intel Japan K.K.*, and has held various management positions in microprocessor system development, system support for embedded board computers, engineering training, and application engineering for PC, server, and embedded application.
Became PR manager and served as a spokesperson representing Intel K.K.
Named General Manager of Intel Architecture Technology Group, Intel K.K.
Named General Manager of Marketing Headquarters, Intel K.K.
Named General Manager of Technology & Manufacturing Group, Intel K.K.
Named Director and General Manager of Technology & Manufacturing Group, Intel K.K.
Named Director and Vice President, General Manager of Technology & Manufacturing Group, Intel K.K. |
Amkor Strategy for Packaging Technology
［Speaker］
Choon-Heung Lee
Corporate Vice President, Head of Corp. Technology HQ,
Amkor Technology Korea, Inc.
[Abstract]
3D-TSV technologies are adopted to be one of the most effective ways to achieve highly integrated package structure. However, it is not still early to say it is coming for various reasons of maturity of basic platform, balanced cost-performance, etc..This talk browses the packaging technology trend and the 3D-TSV packaging complexities including the interposer technology named 2.5D and the real 3D device technology that will be the mainstream of future technologies.
[Profile]
Previously spent 8 years at Amkor Technology R&D as a development researcher of Semiconductor package design and new package development after receiving the doctor’s degree in Physics in Case Western Reserve Univ. Cleveland, then has served as Chief Technology Officer of Amkor Technology since January 2004.
Responsible for leading the Consortium in Korea nation’s the Next- Generation Growth Engine Program of Semiconductor Advanced technology R&D (including interconnects, process, metrology in TSV and CiS) from 2006 thru 2009. And has published over 60 articles, and holds 19 filed and 8 pending US patents.
(Honorifics omitted)
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