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  • What is ICP?

    Variety of Packaging Technologies for IC Devices

    Advanced products/technologies/services will be showcased, necessary for downsizing and advance of semiconductors, LEDs, power devices, sensors and MEMS devices. Must-attend show for all technical persons involved in IC packaging.

  • Technical Conference Committee

    IC PACKAGING EXPO Technical Conference Committee is comprised of leading experts in the industry.
    Their valuable insights have played a strong role in determining the event's conference program and direction.

    Akito Yoshida
    Vice President - FCBGA
    Product Line,
    AMKOR TECHNOLOGY, INC.

    Tsutomu Sekiya
    General Manager, Tokyo
    Sales Branch, Sales Div.,
    C. UYEMURA & CO., LTD.

    Shoji Uegaki
    Director, Business
    Development Dept.,
    ASE GROUP

    Takashi Tsujimura
    Representative Director,
    KULICKE AND SOFFA
    (JAPAN), LTD.

    Yoichi Hiruta
    Chief Technology Officer,
    J-DEVICES CORP.

    Hiroshi Suzuki
    General Manager, Information & Telecommunication Materials Div.,
    SUMITOMO BAKELITE CO., LTD.

    Souichiro Kishimoto
    Executive Officer, Advanced
    Material Div.,
    DEXERIALS CORP.

    Katsunori Okura
    Senior General Manager,
    Research Labs.,
    DENSO CORP.

    Chiaki Takubo
    Senior Manager, Memory Packaging Development Dept., Memory Div.,
    Semiconductor & Storage
    Products Co.,
    TOSHIBA CORP.

    Itsuo Watanabe
    Executive Officer, General
    Manager, Marketing & Sales
    Operations,
    HITACHI CHEMICAL CO.,
    LTD.

    Osamu Nogimura
    Senior Vice President, Production and Technology Unit,
    RENESAS ELECTRONICS CORP.


    (As of November 14th, 2014 [Honorifics omitted])

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Contact Us

ICP Show Management
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL : +81-3-3349-8519
FAX : +81-3-3349-8530
E-mail :
For Exhibiting>>
inw@reedexpo.co.jp
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visitor-eng.inw@reedexpo.co.jp

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