• Exhibit Profile

    Assembly Equipment

    • Wire Bonders
    • Die Bonders
    • FC Bonders
    • Other Various Bonders
    • Molding Machines
    • Resin Coating Machines
    • Dicing Machines
    • Lead Processing Machines
    • Laser Processors
    • Other Equipment for IC Packaging

     

    Packaging Materials/Components

    • Sealant (Mold Materials)/Under-fill Materials
    • ACF/NCF, ACP/NCP
    • Die Adhesives
    • Lead Frames
    • Bonding Wires
    • Tape Materials
    • Soldering Balls/Materials
    • Bump Materials
    • Packaging Substrates
    • (PCBs, Tape Substrates, Ceramic Substrates, etc.)
    • Other Materials/Components

     

    Analysis/Simulation Software for IC Packaging

    • Analysis Services/Software
    • Simulation Software
    • Various Software, etc.

     

    Various Packages

    • CSP
    • BGA
    • Wafer Level CSP
    • MCM, etc.
  • Semiconductor Device Inspection & Testing Zone

    Specialised in Inspection Equipment/Testers/Measurement for Semiconductor Device!

    • Memory Testers
    • SoC Testers
    • IC Test Sockets
    • IC Test Clips
    • Inspection Connectors
    • Burn-in Inspection Equipment
    • (Reliability Test, Thermal Resistance Test)
    • IC Vision Inspection System
    • Bump Vision Inspection System
    • X-ray Inspection Equipment
    • Circuit Modification System/Software
    • Defect Analysis System/Software
    • Measurement Equipment
    • Test Services
    • Analysis Services
    • Handlers
    • Probe Cards
    • Probes  etc.
  • SATS/Contract Design Services Zone

    Gathering World's TOP companies specialised in IC design, assembly and testing services!

    • Semiconductor
    • LED Packaging Solutions
    • Sensor Module Assembly
    • Mounting, Packaging Solutions
    • MEMS Device Packaging Solutions
    • Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.
  • Plating/Etching Zone

    Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.

    • Plating Materials/Chemicals/Equipment
    • Plating Process
    • Etching Chemicals/Equipment
    • Etching Process
    • Inspection Equipment
    • Surface Processing Technology/Related Products, etc.
  • MEMS Packging Zone

    3D Integration, 3D Packaging Technologies for MEMS Devices Gather!

    [MEMS Device Manufacturing Equipment]

    • Dicing Machines
    • Die Bonders
    • Wire Bonders
    • Flipchip Bonders
    • Microchip Bonders etc.

    [Molding Machines]

    • Welding Machines
    • Fine Processing Equipment
    • Drilling Machines
    • Plating Equipment
    • Coating Machines
    • Sputtering System
    • Exposure Equipment
    • Vacuum Equipment
    • Bonding Equipment
    • Heat Press Machines
    • Imprinting Systems
    • Coaters, Developers
    • Spray Coaters
    • Embossing Systems
    • Laser Beam Writers
    • Etching Equipment
    • Cleaning Systems
    • Drying Systems
    • Conveying Equipment etc.

    [Evaluation/Measurement/Testing Equipment]

    • Measurement Equipment
    • Evaluation Equipment
    • Analysis Equipment
    • Microscopes (Laser Microscopes, Electron Microscopes, Transmission Electron Microscopes, etc.)
    • Analysis Systems
    • Vision Inspection Equipment
    • X-ray Inspection Equipment etc.

    [MEMS Packaging Materials]

    • Substrates
    • Lead Frames
    • Glass Substrates
    • Silicon Wafers
    • SB Wafers
    • Soldering Balls
    • Bump Materials
    • Adhesives
    • Taping Materials
    • Sealants
    • Bonding Wires
    • Plating Materials, Chemicals
    • Chemicals
    • Etching Materials
    • Nano-imprint Materials
    • Resist Materials
    • Adhesives
    • Protective Materials etc.

    [MEMS Foundry Services (Contract Design, Prototype, Manufacturing)]

    [Design Tools, Analysis and Simulation Software]

    [Other Various MEMS Packaging Technologies]

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Contact Us

ICP Show Management
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL : +81-3-3349-8519
FAX : +81-3-3349-8530
E-mail :
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