Exhibition Outline

• Visitor Profile

  Professionals of semiconductor assembly & electronics manufacturers in fields such as:
  Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc.
  Visitors are from:

  Semiconductor Manufacturers Assembly Manufacturers/SATS Sensor Manufacturers

  Set Manufacturers (in high-density SMT) MEMS Devices/LED Manufacturers Automotive Electronics Manufacturers

• • Exhibit Profile

    Assembly Equipment
    Wire Bonders Die Bonders FC Bonders Other Various Bonders Molding Machines	Resin Coating Machines Dicing Machines Lead Processing Machines Laser Processors Other Equipment for IC Packaging

    　

    Packaging Materials/Components
    Sealant (Mold Materials)/Under-fill Materials ACF/NCF, ACP/NCP Die Adhesives Lead Frames Bonding Wires Tape Materials	Soldering Balls/Materials Bump Materials Packaging Substrates (PCBs, Tape Substrates, Ceramic Substrates, etc.) Other Materials/Components

    　

    Analysis/Simulation Software for IC Packaging
    Analysis Services/Software Simulation Software	Various Software, etc.

    　

    Various Packages
    CSP BGA	Wafer Level CSP MCM, etc.
  • Semiconductor Device Inspection & Testing Zone
    

    Specialised in Inspection Equipment/Testers/Measurement for Semiconductor Device!

    Memory Testers SoC Testers IC Test Sockets IC Test Clips Inspection Connectors Burn-in Inspection Equipment (Reliability Test, Thermal Resistance Test) IC Vision Inspection System Bump Vision Inspection System

    X-ray Inspection Equipment Circuit Modification System/Software Defect Analysis System/Software Measurement Equipment Test Services Analysis Services Handlers Probe Cards Probes 　etc.
  • SATS/Contract Design Services Zone
    

    Gathering World's TOP companies specialised in IC design, assembly and testing services!

    Semiconductor LED Packaging Solutions Sensor Module Assembly

    Mounting, Packaging Solutions MEMS Device Packaging Solutions Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.
  • Plating/Etching Zone
    

    Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.

    Plating Materials/Chemicals/Equipment Plating Process Etching Chemicals/Equipment

    Etching Process Inspection Equipment Surface Processing Technology/Related Products, etc.
  • MEMS Packging Zone
    

    3D Integration, 3D Packaging Technologies for MEMS Devices Gather!

    [MEMS Device Manufacturing Equipment］
    Dicing Machines Die Bonders Wire Bonders	Flipchip Bonders Microchip Bonders etc.
    [Molding Machines］
    Welding Machines Fine Processing Equipment Drilling Machines Plating Equipment Coating Machines Sputtering System Exposure Equipment Vacuum Equipment Bonding Equipment Heat Press Machines	Imprinting Systems Coaters, Developers Spray Coaters Embossing Systems Laser Beam Writers Etching Equipment Cleaning Systems Drying Systems Conveying Equipment etc.
    [Evaluation/Measurement/Testing Equipment］
    Measurement Equipment Evaluation Equipment Analysis Equipment Microscopes (Laser Microscopes, Electron Microscopes, Transmission Electron Microscopes, etc.)	Analysis Systems Vision Inspection Equipment X-ray Inspection Equipment etc.
    [MEMS Packaging Materials］
    Substrates Lead Frames Glass Substrates Silicon Wafers SB Wafers Soldering Balls Bump Materials Adhesives Taping Materials	Sealants Bonding Wires Plating Materials, Chemicals Chemicals Etching Materials Nano-imprint Materials Resist Materials Adhesives Protective Materials etc.
    [MEMS Foundry Services (Contract Design, Prototype, Manufacturing)］
    [Design Tools, Analysis and Simulation Software］
    [Other Various MEMS Packaging Technologies］