Exhibition Outline

Dates: January 13 [Wed] - 15 [Fri], 2016

Open Hours: 10:00-18:00 (Last day until 17:00)

Venue: Tokyo Big Sight, Tokyo, JAPAN

Organised by: Reed Exhibitions Japan Ltd.


Concurrent Event: 

Special Exhibit Zones:

  • Power Device Technology Zone
  • SATS/Contract Design Services Zone
  • Plating/Etching Zone

Concurrent Shows held inside NEPCON JAPAN 2016 – 45th Electronics R&D and Manufacturing Technology Expo

Concurrent Shows of NEPCON JAPAN 2016 – 45th Electronics R&D and Manufacturing Technology Expo

  • Visitor Profile

    Professionals of semiconductor assembly & electronics manufacturers in fields such as:
    Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc.
    Visitors are from:

    • Semiconductor Manufacturers
    • Assembly Manufacturers/SATS
    • Sensor Manufacturers
    • Set Manufacturers (in high-density SMT)
    • MEMS Devices/LED Manufacturers
    • Automotive Electronics Manufacturers
    • Exhibit Profile

      Assembly Equipment

      • Wire Bonders
      • Die Bonders
      • FC Bonders
      • Other Various Bonders
      • Molding Machines
      • Resin Coating Machines
      • Dicing Machines
      • Lead Processing Machines
      • Laser Processors
      • Other Equipment for IC Packaging


      Packaging Materials/Components

      • Sealant (Mold Materials)/Under-fill Materials
      • ACF/NCF, ACP/NCP
      • Die Adhesives
      • Lead Frames
      • Bonding Wires
      • Tape Materials
      • Soldering Balls/Materials
      • Bump Materials
      • Packaging Substrates
      • (PCBs, Tape Substrates, Ceramic Substrates, etc.)
      • Other Materials/Components


      Analysis/Simulation Software for IC Packaging

      • Analysis Services/Software
      • Simulation Software
      • Various Software, etc.


      Various Packages

      • CSP
      • BGA
      • Wafer Level CSP
      • MCM, etc.
    • SATS/Contract Design Services Zone

      Gathering World's TOP companies specialised in IC design, assembly and testing services!

      • Semiconductor
      • LED Packaging Solutions
      • Sensor Module Assembly
      • Mounting, Packaging Solutions
      • MEMS Device Packaging Solutions
      • Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.
    • Plating/Etching Zone

      Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.

      • Plating Materials/Chemicals/Equipment
      • Plating Process
      • Etching Chemicals/Equipment
      • Etching Process
      • Inspection Equipment
      • Surface Processing Technology/Related Products, etc.

>>>VIP Privilege Application

Contact Us

ICP Show Management
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL : +81-3-3349-8519
FAX : +81-3-3349-8530
E-mail :
For Exhibiting>>
For Visiting>>

Exhibitors Website Click Here!

Organised by Reed Exhibitions