Visitor Profile - 15th IC PACKAGING TECHNOLOGY EXPO - Japan's MOST POWERFUL Exhibition specialised in IC Final Manufacturing and Packaging Technology for Sensors, MEMS Devices, Opto Devices, etc.

Visitor Profile

Professionals of semiconductor assembly & electronics manufacturers in fields such as:
Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc.
Visitors are from:

Semiconductor Manufacturers
Assembly Manufacturers/SATS
Sensor Manufacturers

Set Manufacturers (in high-density SMT)
MEMS Devices/LED Manufacturers
Automotive Electronics Manufacturers

Quick Links

Exhibition Outline
Photo Highlight 2013
Previous (2013) List of Exhibitors
Previous (2013) Technical Conference Program

Contact Us

ICP Show Management
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL : +81-3-3349-8518
FAX : +81-3-3349-8530
E-mail : inw@reedexpo.co.jp