SATS / Contract Design Services Zone: IC PACKAGING TECHNOLOGY EXPO - Japan's MOST POWERFUL Exhibition specialised in IC Final Manufacturing and Packaging Technology for Sensors, MEMS Devices, Opto Devices, etc.


▸ Exhibition Outline

▸ Merits of Exhibiting

▸ Photo Highlight 2010

▸ Previous List of Exhibitors

▸ Support Service for Exhibitors

▸ Schedule for Exhibitors

▸ Exhibiting Information Request

SATS / Contract Design Services Zone -Gathering World's TOP companies specialised in IC design, assembly and testing services!

Exhibits Profile

● Semiconductor
● LED Packaging Solutions
● Sensor Module Assembly
● Mounting, Packaging Solutions
● MEMS Device Packaging Solutions
● Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.

APPLY NOW TO EXHIBIT AT IC PACKAGING TECHNOLOGY EXPO!

Take your opportunity to participate and expand your business in the Asia's Electronics Manufacturing market !!

ICP Show Management
Attn: Kanako Otsuka (Ms.), Hajime Suzuki (Mr.), Taikoku Kin (Mr.)
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL: +81-3-3349-8502 FAX: +81-3-3349-4900
E-mail: inw@reedexpo.co.jp

	▸ To Exhibit Exhibition Outline Merits of Exhibiting Photo Highlight 2010 Previous List of Exhibitors Support for Exhibitors Schedule for Exhibitors Exhibiting Info Request		▸ Previous Show Visitor Count Photo Highlight 2010 Show's Movie List of Exhibitors e-Guidebook Technical Conference Floor Plan		▸ To Visit Visitor Pre-registration Access to Venue Hotel Accommodation Tokyo Sightseeing		▸ For Press News Release Visitor Count Photo Highlight 2010 Show's Movie 2010 Previous Highlights of Exhibitors Media Partners		▸ Registrations Exhibiting Info Request Visitor Pre-registration		▸ Concurrent Shows NEPCON JAPAN ├INTERNEPCON JAPAN ├ELECTROTEST JAPAN ├ELE TRADE ├PWB EXPO ├MATERIAL JAPAN └MicroTech JAPAN CAR-ELE JAPAN EV JAPAN Automotive Lightening Technology Expo LIGHTING JAPAN