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3D Integration, 3D Packaging Technologies for MEMS Devices Gather! |
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| Visitor Profile |
Engineers specialised in Design, R&D, Manufacturing, Production Management, Quality Control from:
- MEMS Device Manufacturers
(MEMS Sensors, Integrated MEMS, Power MEMS, Bio MEMS, Fluid MEMS, RF-MEMS, Optical MEMS)
- Semiconductor Manufacturers
- Electronic Components Manufacturers
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| Exhibit Profile |
MEMS Device Manufacturing Equipment |
- Dicing Machines
- Die Bonders
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- Wire Bonders
- Flipchip Bonders
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| Molding Machines |
- Welding Machines
- Fine Processing Equipment
- Drilling Machines
- Plating Equipment
- Coating Machines
- Sputtering System
- Exposure Equipment
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- Vacuum Equipment
- Bonding Equipment
- Heat Press Machines
- Imprinting Systems
- Coaters, Developers
- Spray Coaters
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- Embossing Systems
- Laser Beam Writers
- Etching Equipment
- Cleaning Systems
- Drying Systems
- Conveying Equipment etc.
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| Evaluation/Measurement/Testing Equipment |
- Measurement Equipment
- Evaluation Equipment
- Analysis Equipment
- Microscopes (Laser Microscopes, Electron Microscopes, Transmission Electron Microscopes, etc.)
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- Analysis Systems
- Vision Inspection Equipment
- X-ray Inspection Equipment etc.
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| MEMS Packaging Materials |
- Substrates
- Lead Frames
- Glass Substrates
- Silicon Wafers
- SB Wafers
- Soldering Balls
- Bump Materials
- Adhesives
- Taping Materials
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- Sealants
- Bonding Wires
- Plating Materials, Chemicals
- Chemicals
- Etching Materials
- Nano-imprint Materials
- Resist Materials
- Adhesives
- Protective Materials etc.
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| MEMS Foundry Services (Contract Design, Prototype, Manufacturing) |
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| Design Tools, Analysis and Simulation Software |
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| Other Various MEMS Packaging Technologies |
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| Contact Us |
ICP Show Management
Attn: Kanako Otsuka (Ms.), Hajime Suzuki (Mr.), Taikoku Kin (Mr.)
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL: +81-3-3349-8502 FAX: +81-3-3349-4900
E-mail: inw@reedexpo.co.jp |
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