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Services included in
the exhibit price |
- Exhibit Raw Space (excluding display system cost such as the walls, carpet, etc.)
- Free Invitation Tickets
- Special VIP Customers Invitation System
- Free promotion of exhibition by press released to industry's prominent publication / magazines
- Publishing of your exhibiting information on official website
- Publishing of your company name & exhibiting information in "Floor Plan" & "Official Web Directory" which are distributed to all visitors
*Other services to increase your exhibiting effect are also available. |
| Visitor Profile |
Professionals of semiconductor assembly & electronics manufacturers in fields such as:
Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc.
Visitors are from:
- Semiconductor Manufacturers
- Set Manufacturers (in high-density SMT)
- Assembly Manufacturers/SATS
- MEMS Devices/LED Manufacturers
- Sensor Manufacturers
- Automotive Electronics Manufacturers
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| Exhibit Profile |
Assembly Equipment |
- Wire Bonders
- Die Bonders
- FC Bonders
- Other Various Bonders
- Molding Machines
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- Resin Coating Machines
- Dicing Machines
- Lead Processing Machines
- Laser Processors
- Other Equipment for IC Packaging
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| Packaging Materials/Components |
- Sealant (Mold Materials)/Under-fill Materials
- ACF/NCF, ACP/NCP
- Die Adhesives
- Lead Frames
- Bonding Wires
- Tape Materials
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- Soldering Balls/Materials
- Bump Materials
- Packaging Substrates
(PCBs, Tape Substrates, Ceramic Substrates, etc.)
- Other Materials/Components
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| Analysis/Simulation Software for IC Packaging |
- Analysis Services/Software
- Simulation Software
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| Various Packages |
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- Wafer Level CSP
- MCM, etc.
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| Semiconductor Device Inspection & Testing Zone |
Specialised in Inspection Equipment/Testers/Measurement for Semiconductor Device!
- Memory Testers
- SoC Testers
- IC Test Sockets
- IC Test Clips
- Inspection Connectors
- Burn-in Inspection Equipment
(Reliability Test, Thermal Resistance Test)
- IC Vision Inspection System
- Bump Vision Inspection System
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- X-ray Inspection Equipment
- Circuit Modification System/Software
- Defect Analysis System/Software
- Measurement Equipment
- Test Services
- Analysis Services
- Handlers
- Probe Cards
- Probes, etc.
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| SATS/Contract Design Services Zone |
Gathering World's TOP companies specialised in IC design, assembly and testing services!
- Semiconductors
- LED Packaging Solutions
- Sensor Module Assembly
- Mounting, Packaging Solutions
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- MEMS Device Packaging Solutions
- Various Outsourcing Services such as Design, Prototype, Manufacturing, Test, etc.
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| Plating/Etching Zone |
Surface Treatment & Finishing Technologies for Semiconductors, PCBs, Electronic Devices, etc.
- Plating Materials/Chemicals/Equipment
- Plating Process
- Etching Chemicals/Equipment
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- Etching Process
- Inspection Equipment
- Surface Processing Technology/Related Products, etc.
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Soldering Zone |
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With strong demands from the industry, this area is launched to gather the most advanced soldering materials and technologies. |
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| Special Area |
MEMS PACKAGING 2011 |
Gathering various packaging technologies for MEMS devices.
- MEMS Device Manufacturing Equipment
- MEMS Device Design Tools, Analysis Software
- MEMS Packaging Materials
- MEMS Foundry Services (Contract Design, Prototype, Manufacturing)
- Evaluation/Measurement/Testing Devices
- Other Various MEMS Packaging Technologies
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| Contact Us |
ICP Show Management
Attn: Kanako Otsuka (Ms.), Hajime Suzuki (Mr.), Taikoku Kin (Mr.)
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL: +81-3-3349-8502 FAX: +81-3-3349-4900
E-mail: inw@reedexpo.co.jp |
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