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Special Zone

Semiconductor Device Inspection & Testing Zone
Exhibit Profile  
  • Memory Testers
  • SoC Testers
  • IC Test Sockets
  • IC Test Clips
  • Inspection Connectors
  • Burn-in Inspection Equipment
    (Reliability Test, Thermal Resistance Test)
  • IC Vision Inspection System
  • Bump Vision Inspection System
  • X-ray Inspection Equipment
  • Circuit Modification System/Software
  • Defect Analysis System/Software
  • Measurement Equipment
  • Test Services
  • Analysis Services
  • Handlers
  • Probe Cards
  • Probes
    etc.

Visitor Profile  
  • Semiconductor Manufacturers
  • LED Manufacturers
  • Sensor Manufacturers
  • Assembly Houses
  • Test Houses

Specialists and engineers from Test, Production Engineering, R&D Divisions in above manufacturers are present.
APPLY NOW TO EXHIBIT AT IC PACKAGING TECHNOLOGY EXPO!
Take your opportunity to participate and expand your business in the Asia's Electronics Manufacturing market !!
Contact Us ICP Show Management
Attn: Kanako Otsuka (Ms.), Hajime Suzuki (Mr.), Taikoku Kin (Mr.)
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL: +81-3-3349-8502  FAX: +81-3-3349-4900
E-mail: inw@reedexpo.co.jp
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