【ICP-9】Future of Automotive Electronics & IC Packaging Technology

Future Outlook of Car Electronics

［Speaker］　
Konrad F. Kaschek
Executive Officer, President of Automotive Electronics Div.,
BOSCH Corp., Japan

[Abstract]
From the environmental point of view, variety of concepts such as: Improvement of efficiency by internal -combustion engine, hybrid, electric cars etc. Increasing demand of safety and mobility. What kind of electronic semiconductor technologies will be needed in the future?

[Profile]
1974-1980 Studies: Physics and Informatics,
University of Hannover/Germany (grad. "Diplomphysicist")
1980-1985 Advanced studies: Plasmaphysics,
University of Hannover/Germany (grad. "Dr. rer. nat.")
1985 IT systems integration for design, engineering and manufacturing,
BOSCH K8 (Automotive Electronics Div.)
1991 Product- and manufacturing- preparation,
BOSCH plant RtW2 Reutlingen (Printed Circuit Boards, Microhybrids, Sensors)
1998 Restructuring of BOSCH AT (Automation Technologies div.)
2001 Projectleader purchasing for post merger integration,
BOSCH Automation Technologies - Mannesmann Rexroth merger
2002 Managing director and plantmanager for,
Bosch Rexroth EM greenfield site in Eger/Hungary
2006-2009 Head of Bosch Rexroth Emerging Markets Purchasing

Packaging Technologies for Automotive Power Electronics

［Speaker］　
Hiroshi Fujimoto
Director, IC Eng. Div. 3,
DENSO Corp.

[Abstract]
The automotive power electronics market is expanding dramatically for fuel saving. In this regard, the innovation of the packaging technology is highly required. This session will introduce the latest application trend and the technology.

Semiconductor Packaging Technology for Automotive

［Speaker］　
Tatsuhiko Akiyama
Chief Professional,
Lead Frame Package Engineering Dept.,
Packaging & Test Technology Div., Production and Technology Unit,
Renesas Electronics Corp.

[Abstract]
With the shift to hybrid or electric cars, the number of semiconductor devices installed in a vehicle further increases. The packaging pecifications, including quality, required for those devices are being diversified. This presentation will report the trends and the development of the in-vehicle semiconductor packages at Renesas Electronics.

(Honorifics omitted)

* Please note that the speakers and programs are subject to change.
* The photographic and video recording rights are reserved to the Show Management.
* Textbooks of some sessions are not available.
* The speech titles and abstracts are composed by speakers.

For more information, please contact: inw-con@reedexpo.co.jp.